MK516 Electronic Manufacturing Technology

6 ECTS - 3-0 Duration (T+A)- . Semester- 3 National Credit

Information

Code MK516
Name Electronic Manufacturing Technology
Term 2024-2025 Academic Year
Term Spring
Duration (T+A) 3-0 (T-A) (17 Week)
ECTS 6 ECTS
National Credit 3 National Credit
Teaching Language İngilizce
Level Doktora Dersi
Type Normal
Mode of study Yüz Yüze Öğretim
Catalog Information Coordinator
Course Instructor
1


Course Goal / Objective

The production of electronic printed circuit boards is a fundamental subject in the field of mechanical engineering. The main objective of the course is to give techniques and methods related to electronic board manufacturing (printed circuit board-PCB) and assembly (printed circuit board assembly-PCBA).

Course Content

Introduction to printed wiring, Types of printed wiring boards, Surface mount technology, Engineering packaging interconnecting system, Layout and standards, Base materials, Surface mount technology materials, circuit components and hardware, Fabrication; drilling and machining, image transfer and plating, Plating, additive plating, etching, Solder resist, bare board testing, Assembly and test, manual component assembly, Conformal coatings, Testing and rework in eelectronic assembly, Throgh-hole and surface mount Soldering. ,

Course Precondition

none

Resources

Printed Circuits Handbook, Edition 6,Clyde Coombs, McGraw-hill

Notes

Lecture notes and books are sufficient. No other resources are needed.


Course Learning Outcomes

Order Course Learning Outcomes
LO01 Knows the product product design rules necessary for economic assembly activities. Can determine the work point for assembly taking into account ergonomic requirements.
LO02 Can create assembly-organization forms for manual assembly.
LO03 Determine the economic efficiency of various assembly ideas.
LO04 Recognize, apply and select the infrastructure modules required for automation of assembly processes. Have knowledge about the design of assembly machines and system.


Relation with Program Learning Outcome

Order Type Program Learning Outcomes Level
PLO01 Bilgi - Kuramsal, Olgusal Understands and applies basic sciences, mathematics and engineering sciences at a high level. 5
PLO02 Beceriler - Bilişsel, Uygulamalı He/she has extensive and in-depth knowledge, including the latest developments in his/her field. 5
PLO03 Bilgi - Kuramsal, Olgusal They reach the latest information in a field and have a high level of proficiency in the methods and skills necessary to comprehend and research them. 4
PLO04 Yetkinlikler - Öğrenme Yetkinliği They carry out a comprehensive study that brings innovation to science and technology, develops a new scientific method or technological product/process, or applies a known method to a new field. 3
PLO05 Yetkinlikler - Bağımsız Çalışabilme ve Sorumluluk Alabilme Yetkinliği Independently perceives, designs, implements and concludes an original research process; manages this process. 2
PLO06 Yetkinlikler - Alana Özgü Yetkinlik Contributes to the science and technology literature by publishing the outputs of its academic studies in respected academic environments. 3
PLO07 Yetkinlikler - İletişim ve Sosyal Yetkinlik Evaluates scientific, technological, social and cultural developments and conveys them to the society with the awareness of scientific impartiality and ethical responsibility. 2
PLO08 Belirsiz Performs critical analysis, synthesis and evaluation of ideas and developments in the field of expertise. 4
PLO09 Yetkinlikler - Öğrenme Yetkinliği Communicates effectively, both verbally and in writing, with those working in the field of specialization and the wider scientific and social community, communicating and discussing at an advanced level of written, oral and visual communication using a foreign language at least at the C1 General Level of the European Language Portfolio. 5
PLO10 Yetkinlikler - Bağımsız Çalışabilme ve Sorumluluk Alabilme Yetkinliği Carries out literature search


Week Plan

Week Topic Preparation Methods
1 Introduction to printed wiring Book-Section 1- Öğretim Yöntemleri:
Gösteri, Anlatım, Soru-Cevap, Tartışma
2 Types of printed wiring boards. Book-Chapter 2- Öğretim Yöntemleri:
Anlatım, Soru-Cevap, Tartışma, Gösteri
3 Surface mount technology, Book-Part 3 Öğretim Yöntemleri:
Anlatım, Soru-Cevap, Gösteri, Tartışma
4 Engineering packaging interconnecting system Book-Part 4 Öğretim Yöntemleri:
Anlatım, Soru-Cevap, Gösteri, Tartışma
5 Layout and standards Book-chapter 5 Ölçme Yöntemleri:
Ödev
6 Base materials Book-Chapter 6 Öğretim Yöntemleri:
Anlatım, Soru-Cevap, Gösteri
7 Surface mount technology materials, circuit components and hardware Book-Chapter 7-8 Öğretim Yöntemleri:
Anlatım, Soru-Cevap, Tartışma, Alıştırma ve Uygulama
8 Fabrication; drilling and machining, image transfer and plating Book-chapter 10, 11, 12 Ölçme Yöntemleri:
Ödev
9 MIDTERM EXAM Books Ölçme Yöntemleri:
Sözlü Sınav
10 Plating, additive plating, etching Book-Chapter 13,14 Öğretim Yöntemleri:
Anlatım, Gösteri, Tartışma
11 Solder resist, bare board testing. Book-Chapter 16,17 Öğretim Yöntemleri:
Gösteri
12 Assembly and test, manual component assembly Book-chapter 18-19 Öğretim Yöntemleri:
Anlatım, Soru-Cevap, Alıştırma ve Uygulama, Gösteri
13 Conformal coatings. Book- Chapter 20, Öğretim Yöntemleri:
Gösteri, Anlatım
14 Testing and rework in electronic assembly Book- Chapter 21,22 Öğretim Yöntemleri:
Anlatım, Gösteri, Tartışma
15 Throgh-hole and surface mount Soldering, Book -chapter 23,27 Öğretim Yöntemleri:
Anlatım, Soru-Cevap, Gösteri, Tartışma
16 Final Exams source book and all lecture notes related to the course Ölçme Yöntemleri:
Sözlü Sınav
17 Final Exams source book and all lecture notes related to the course Ölçme Yöntemleri:
Sözlü Sınav


Student Workload - ECTS

Works Number Time (Hour) Workload (Hour)
Course Related Works
Class Time (Exam weeks are excluded) 13 3 39
Out of Class Study (Preliminary Work, Practice) 13 5 65
Assesment Related Works
Homeworks, Projects, Others 6 5 30
Mid-term Exams (Written, Oral, etc.) 1 2 2
Final Exam 1 2 2
Total Workload (Hour) 138
Total Workload / 25 (h) 5,52
ECTS 6 ECTS

Update Time: 11.10.2024 09:21